Materiales
Materiales
METHOD FOR PRODUCING THERMOSETTING PHENOLIC RESIN-BASED COMPOSITE MATERIAL
04/05/2023 -
Provided is a method for producing a thermosetting phenolic resin-based composite material. A vacuum infusion process is used, a thermosetting phenolic resin is used as a resin matrix, the...
MICROCHANNEL CHIP
09/03/2023 -
A microchannel chip (1) comprises: a resin substrate (2) manufactured using a mold formed by direct carving machining, and having a channel groove (21) on one surface thereof; and a covering...
PORTADOR PARA UNA HERRAMIENTA DE ABRASION Y METODO PARA ELABORAR UN PORTADOR.
18/02/2021 -
The invention relates to a supporting body (1) for a grinding tool (2), which comprises an abrasive pad (5) having a preferably circumferential supporting surface (3) for an abrasive material (4),...
RESIN COMPOSITION FOR FLUXES, SOLDER PASTE AND PACKAGE STRUCTURE
09/02/2023 -
The present invention provides a resin composition for fluxes, the resin composition enabling a cured product thereof to have improved moisture-resistant insulation properties. This resin...
POLYAMIDE RESIN COMPOSITION, POLYAMIDE RESIN COMPOSITION FOR THREE-DIMENSIONAL MODELING, AND THREE-DIMENSIONAL MODEL OF SAME
02/02/2023 -
The present invention relates to a polyamide resin composition which contains 60% by mass to 95% by mass of a polyamide resin (A) and 5% by mass to 40% by mass of a novolac type phenolic resin (B)...
NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE
29/12/2022 -
This negative-type photosensitive polymer is a solvent-soluble negative-type photosensitive polymer which includes a structural unit containing an imide ring and has a group containing a terminal...
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE POLYMER, CURED FILM, AND SEMICONDUCTOR DEVICE
29/12/2022 -
A negative photosensitive resin composition according to the present invention comprises a polyimide (A), a polyfunctional (meth)acrylate-containing cross-linking agent (B), and a...
NEGATIVE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE
29/12/2022 -
A negative photosensitive polymer according to the present invention is solvent-soluble, includes a structural unit containing an imide ring, and comprises a group represented by general formula...
A RIGNIN MODIFIED PHENOLIC RESIN PROCESS OF PREPARING THE RIGNIN MODIFIED PHENOLIC RESIN AND ARTICLE INCLUDING THE SAME
15/12/2022 -
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PHENOLIC RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE
10/11/2022 -
Provided is a phenolic resin which is a reaction product of a catechol compound with an ortho-xylylene-skeleton-containing compound, the phenolic resin being characterized by having a catechol...
MÉTODO PARA A CONSTRUÇàO EM CAMADAS DE CORPOS COMPOSTOS POR MATERIAL DE BASE DE MOLDAGEM REFRATÁRIA E RESÓIS, CORPOS TRIDIMENSIONAIS PRODUZIDOS POR ESTE MÉTODO, MOLDE OU NÚCLEO E AGLUTINANTE PARA CONSTRUÇàO DE CORPOS TRIDIMENSIONAIS
23/08/2022 -
MÉTODO PARA A CONSTRUÇÃO EM CAMADAS DE CORPOS COMPOSTOS POR MATERIAL DE BASE DE MOLDAGEM REFRATÁRIA E RESÓIS, CORPOS TRIDIMENSIONAIS PRODUZIDOS POR ESTE MÉTODO, MOLDE OU NÚCLEO E...
MÉTODO PARA A CONSTRUÇàO EM CAMADAS DE CORPOS COMPOSTOS POR MATERIAL DE BASE DE MOLDAGEM REFRATÁRIA E RESÓIS, CORPOS TRIDIMENSIONAIS PRODUZIDOS POR ESTE MÉTODO, MOLDE OU NÚCLEO E AGLUTINANTE PARA CONSTRUÇàO DE CORPOS TRIDIMENSIONAIS
23/08/2022 -
MÉTODO PARA A CONSTRUÇÃO EM CAMADAS DE CORPOS COMPOSTOS POR MATERIAL DE BASE DE MOLDAGEM REFRATÁRIA E RESÓIS, CORPOS TRIDIMENSIONAIS PRODUZIDOS POR ESTE MÉTODO, MOLDE OU NÚCLEO E...
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE
18/08/2022 -
A photosensitive resin composition of the present invention comprises: a polymer A having a constituent unit represented by general formula (a) below; and a polymer B containing a polyimide having...
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE
18/08/2022 -
A photosensitive resin composition of the present invention comprises: a polymer A having a constituent unit represented by general formula (a) below; and a polymer B containing a polyimide having...
METHOD OF THICKENING PHENOLIC RESIN AND USE THEREOF TO FORM VEHICLE COMPONENTS
19/05/2022 -
A method of building viscosity in a sheet molding composition is provided that includes a thickening agent of at least one of magnesium oxide, magnesium hydroxide, calcium oxide, calcium...
ECO-FRIENDLY SEMI-NONCOMBUSTIBLE EXTERIOR MATERIAL AND METHOD FOR MANUFACTURING SAME
12/05/2022 -
One aspect of the present specification provides an eco-friendly semi-noncombustible exterior material including: a core part (10) formed by impregnating a paper or fabric base with a...
HEAT RESISTANT RESIN COMPOSITION, HEAT RESISTANT FILM ADHESIVE AND PROCESS FOR PRODUCING THE SAME
31/03/2001 -
A HEAT RESISTANT RESIN COMPOSITION COMPRISING, AS THE MAIN COMPONENTS,(A) 100 PARTS BY WEIGHT OF AN ORGANIC SOLVENT-SOLUBLE POLYIMIDE RESIN HAVING A GLASS TRANSITION TEMPERA-TURE .OF 350?C OR...
MULTILAYER FILM AND PACKAGE
21/04/2022 -
A multilayer film, including: a barrier layer in which an unstretched first film layer containing a first resin, and an unstretched second film layer containing a second resin different from the...
METHOD FOR PRODUCING RESIST PATTERN, RESIST PATTERN AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCTION OF TRANSPARENT MULTILAYER MEMBER
24/03/2022 -
The present invention provides a method for producing a resist pattern, said method enabling the achievement of a fine resist pattern having high heat resistance, wherein a dilute weak alkaline...
METHOD FOR MANUFACTURING SANDWICH PANEL AND SANDWICH PANEL
17/03/2022 -
This method for manufacturing a sandwich panel (100) includes: a step for preparing a plurality of sheet-like prepregs (211); a step for obtaining a composite surface material (40) by performing a...