Envase
Envase
Effects of Thermal Processing on the Multiscale Mechanical Behavior of Laser Directed Energy Deposited CoCrMo Alloy
03/04/2026 -
Thermal processing of additive‐manufactured CoCrMo transforms a heterogeneous hexagonal close‐packed /face‐centered cubic (FCC) microstructure into an annealed, twin‐rich FCC matrix. Short...
Structural Color Inkjet Printing With Mie‐Resonant Silicon Nanoparticles
03/04/2026 -
Water‐based inks incorporating Mie‐resonant silicon nanoparticles were developed, and their application to structural color inkjet printing was demonstrated. By controlling the nanoparticle size...
Organic Single‐component Photovoltaics: The Critical Role of the Interplay between Local‐exciton and Charge‐transfer Electronic States
04/04/2026 -
This Perspective presents an overview of the electronic structure and free‐charge generation in Y6 films. A special consideration is devoted to the role of the charge‐transfer nature of the...
Resistance to Overdoping Allows Over 2000 S cm−1 Conductivity in P(g3BTTT) With Anion‐Exchange Doping
04/04/2026 -
Anion‐exchange doping of conjugated polymers is an effective way to achieve high conductivities. Here, we report over 2000 S cm−1 electrical conductivity for doped P(g3BTTT). In addition, we...
Surface In Situ Compositing of Reactive Liquid‐Metal Anchored 2D Nanomaterial Skins for Active Composite Current Collectors
02/04/2026 -
Functional nanoskins by surface in situ compositing of reactive liquid‐metal and 2D nanomaterials are realized through a scalable roll‐to‐roll solvent‐free sponge‐rubbing coating strategy....
Monolithic Integration of Crack‐Free 2D Bi2O2Se via Stress Modulation
02/04/2026 -
A composite metal transfer medium comprising tensile‐stressed Ni and nearly stress‐free Cu was developed to enable intact exfoliation and prevent the cracking of 2D Bi2O2Se films. By modulating...
Effects of TiB2 Addition on the Microstructure, Tribological Behavior, and Corrosion Resistance of Al17Cr10Fe35Ni36Mo2 Coatings Fabricated by Laser Cladding
29/03/2026 -
By introducing TiB2 particles into the AlCrFeNiMo dual‐phase high‐entropy alloy (HEA), finely dispersed σ phases are formed during laser cladding process, while the grain size of coating is...
Directional Anchoring Doping Networks for Robust Polymeric Bioelectronics
28/03/2026 -
ABSTRACTThe development of conductive polymers that simultaneously achieve high electrical conductivity and tissue‐like stretchability represents a persistent challenge in bioelectronics. Here, we...
Solvent‐Mediated Reactivity Control of Lewis‐Paired Dopants as a Versatile Strategy for Tunable and Stable Doping of Organic Semiconductors
29/03/2026 -
Solvent‐mediated reactivity control of Lewis‐paired dopants enables highly efficient, finely tunable, and stable doping of organic semiconductors. The optimally doped semiconductor films exhibit...
Tailored Vapor Deposition Unlocks Large‐Grain, Wafer‐Scale Epitaxial Growth of 2D Magnetic CrCl3
29/03/2026 -
A tailored physical vapor transport deposition (PVTD) method enables wafer‐scale epitaxial growth of 2D magnetic CrCl3. By inhibiting light‐exposure and dynamically controlling precursor flux and...
