Eléctrico
Eléctrico
METHOD AND DEVICE FOR PRINTING COVER LAYER OF DISPLAY DEVICE
02/01/2025 -
Disclosed in the present application are a method and device for printing a cover layer of a display device. The method comprises: recognizing a boundary area of metal wiring on a display panel,...
SMART FIBERS FOR MEDICAL DEVICES
02/01/2025 -
Disclosed are antenna fiber sensors and systems incorporating the sensors, methods of making the sensors, and methods of using the sensors. The sensor is a thermoplastic elastomeric polymer...
Systems, methods, and devices for volumetric printing of solid state polymer resin
24/12/2024 -
The disclosure provides systems for 3D printing. A 3D printer system includes one or more sources of actinic radiation characterized at least by a powered state and an unpowered state. A resin...
PREPARATION METHOD FOR SILICONE RUBBER WIRE FOR HOME DECORATION
02/01/2025 -
Disclosed in the present invention is a preparation method for a silicone rubber wire for home decoration. The preparation method comprises the following steps: S1, stretching wire cores, which...
PREPARATION METHOD FOR SILICONE RUBBER WIRE FOR HOME DECORATION
02/01/2025 -
Disclosed in the present invention is a preparation method for a silicone rubber wire for home decoration. The preparation method comprises the following steps: S1, stretching wire cores, which...
CABLE TIE
17/12/2024
OPTICAL CABLE REUSE SYSTEM
19/12/2024 -
Provided is an optical cable reuse system comprising: a code which is attached to an optical cable and in which is stored component information about the outer jacket of the optical cable; an...
CHIP PACKAGE STRUCTURE
19/12/2024 -
A chip package structure, comprising: an isolation frame (10), a first, a second, a third and a fourth base island, a first and a second substrate, and a first, a second, a third and a fourth...
THERMOFORMABLE ELECTRONIC SUBSTRATES
19/12/2024 -
A thermoformable electronic substrate having a first substrate layer of 4-way stretch fabric that includes at least one conductive trace printed thereon and a second substrate layer of a...
CHIP PACKAGE STRUCTURE
19/12/2024 -
A chip package structure, comprising: an isolation frame (10), a first, a second, a third and a fourth base island, a first and a second substrate, and a first, a second, a third and a fourth...
Absorption and Retention Systems for Vehicle Leaks
12/12/2024 -
An absorption and retention system for vehicle leaks consists of a top absorbent pad received by a bottom layer, the two being fused together. The combination of top pad and bottom layer are...
Brida para cables liberable
05/12/2024
Brida para cables liberable
05/12/2024
IMAGE GUIDED SURGERY SYSTEM GUIDE WIRE AND METHODS OF MANUFACTURE AND USE
11/12/2024 -
The present disclosure provides a guide wire system comprising (a) a guide wire having a distal end and a proximal end, (b) a first connector coupled to the proximal end of the guide wire, (c) a...
A flame retardant protective cover for covering busbars and wires of an electric vehicle battery to prevent electric vehicle fire and a manufacturing method and manufacturing apparatus thereof
20/11/2024 -
본 발명의 전기차 화재 예방을 위한 전기차 배터리의 버스바 및 전선 피복용 난연성 보호커버, 그리고 이의 제조방법 및 제조장치는, 전기차...
MODE 2 WINDING PROTECTIVE SHELL
05/12/2024 -
A mode 2 winding protective shell, which relates to the field of new energy vehicle charging. The mode 2 winding protective shell comprises a control box body (1), wherein a winding protective...
PLASTIC SHELF TRIM COMPRISING A FILLER AND A STORAGE SYSTEM COMPRISING THE SHELF TRIM
05/12/2024 -
The present disclosure relates to a shelf trim 5 for a wire shelf 3, the shelf trim com- prising a plastic material with an inorganic filler and being elongated to a length L to fit on the front...
RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
28/11/2024 -
Provided is a resin composition comprising a curable prepolymer containing a vinylbenzyl group and an indene ring and having a weight average molecular weight of 50,000 or greater. Also provided...
RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
28/11/2024 -
The present invention relates to: a resin composition that contains (A) a thermosetting resin, (B) at least one substance which is selected from the group consisting of a conjugated diene polymer...
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
28/11/2024 -
The present invention relates to: a resin composition containing (A) a siloxane-modified maleimide resin, (B) a conjugated diene-based polymer, and (C) a phosphorus-based flame retardant; and a...
PRINTING METHOD BASED ON HIGH-TEMPERATURE AND LOW-TEMPERATURE BI-MATERIAL SPATIAL DISTRIBUTION
28/11/2024 -
The present invention provides a printing method based on high-temperature and low-temperature bi-material spatial distribution. By means of setting of a filling element body type, the continuous...
