Industria 4.0
Industria 4.0
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
06/09/2026 -
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review...
Mo‐Based Multiphase Interface Design for PcBN Composites: Enhanced Interfacial Bonding, Mechanical, and Cutting Performances
06/09/2026 -
This work adopts cubic press sintering to construct Mo‐derived multiphase interfaces in PcBN. 6 wt% Mo delivers peak mechanical properties, including 1626 MPa flexural strength and 3905 HV...
Single‐Source Polymer‐Derived SiC/HfC Composites: Cross‐Linking Mechanism, Microstructure, and Oxy‐Propane Ablation Resistance
04/09/2026 -
A single‐source SiC/HfC precursor is synthesized from polysiloxane and Hf(acac)4, followed by pyrolysis and spark plasma sintering to produce dense composites. With 20 wt% Hf modification, the...
High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges
03/09/2026 -
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and...
Temperature‐Dependent Tensile Deformation, Microstructural Evolution, and Machine Learning Prediction of Wire Laser Metal‐Deposited Ti–6Al–4V Alloy
31/08/2026 -
This study demonstrates how different deformation temperature (25, 100, 200, and 300 °C) significantly influence the mechanical properties and deformation mechanism of WLMD Ti–6Al–4V alloy,...
Microstructural Evolution and Simultaneous Enhancement of Mechanical and Tribological Properties in Low‐Mass‐Fraction B4C/7075 Al Composites
31/08/2026 -
The incorporation of 2 wt% B4C simultaneously enhances the mechanical properties and wear resistance of B4C/7075 Al composites. This improvement originates from uniformly dispersed B4C particles,...
Localized Electrochemical Deposition of Ni Microstructure With 3D‐Printed Solution Flow‐Type Microdroplet Cell
31/08/2026 -
A new 3D‐printed solution flow‐type microdroplet cell (SF‐MDC) enables highly localized electrochemical deposition of Ni microstructures on a Cu substrate. By controlling deposition parameters...
Flexible Osmotic Energy Batteries Enabled by Stacked Bicontinuous‐Network Hydrogels
02/09/2026 -
Here, we overcome the permselectivity‐permeability tradeoff in hydrogel membranes through a bicontinuous architecture comprising interpenetrating hydrophilic and hydrophobic phases. The hydrophobic...
Design of a Multistable Finger Prosthesis with Programmable Metamaterials
30/08/2026 -
This research article shows the development of a multistable programmble metamaterial for the use as a finger prosthesis. The material was designed on different hierarchical levels where the...
Biomedical High‐Entropy Alloys: From Composition and Processing to Clinic Implants
27/08/2026 -
Why are biomedical high‐entropy alloys rapidly emerging as the next generation of implant materials? Their multi‐principal‐element design unlocks property combinations inaccessible to...
Versatile Sacrificial Mold‐Assisted 3D Printing for High‐Performance Mechanoluminescent Structures Toward Impact Protection and Visualization Monitoring
28/08/2026 -
A versatile sacrificial mold strategy is proposed to fabricate high‐performance 3D mechanoluminescent structures, and its versatility is verified using both flexible and rigid matrices. By...
Real Time Self‐Monitoring of Adhesion State via Machine Learning‐Assisted Traffic Light Color‐Coding in Silicone‐Based Smart Superglue
28/08/2026 -
Machine learning‐assisted paradigm toward real time self‐monitoring of the adhesion states via conductive supramolecular adhesives is reported, featuring the intelligentization via the...
Molecularly Engineered Degradable PCTPU–PAA Dielectrics With Boosted Carrier Mobility for Retina‐Mimic Neuromorphic Visual Sensors Toward Closed‐Loop Green Flexible Electronics
27/08/2026 -
Degradable PCTPU–PAA composite dielectrics with hydrogen‐bond networks resolve the performance‐sustainability trade‐off of flexible electronics. The materials deliver superior stretchability,...
